The requirements for precious metal sputtering targets are higher than those of the traditional materials industry. Generally, the requirements include, for example, size, flatness, purity, various impurity contents, density, N/O/C/S ratios, grain size and defect control; higher or special requirements may include: surface roughness, resistance value, grain size uniformity, composition and microstructure uniformity, foreign matter (oxide) content and size, magnetic permeability, ultra-high density and ultra-fine grain size, etc.